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MIRTEC announces that it was awarded a 2016 Global Technology Award in the category of Inspection – SPI for its MS-11e 3D SPI Machine. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, Illinois during SMTA International.
“It is truly our pleasure to accept this award on behalf of MIRTEC’s extremely talented engineering team for their outstanding performance in the design and development of the MS-11e 3D SPI machine,” stated Brian D’Amico, President of MIRTEC’s North American Sales and Service Division. “We are confident that this advanced technology will not only provide unprecedented speed and performance to the electronics inspection industry, but will undoubtedly set a new standard by which all other 3D SPI inspection equipment will be measured.”
The MS-11e 3D SPI Machine is configured with MIRTEC’s exclusive 15 Mega Pixel CoaXPress Vision System, providing enhanced image quality, superior accuracy and incredibly fast inspection rates. It uses Dual Projection “Shadow Free” 3D Moiré Technology combined with a Precision Telecentric Compound Lens and Precision Laser PCB Warpage Compensation to accurately characterize each solder deposition post-screen print.
The MS-11e precisely measures solder volume, area, shape deformity and X/Y position, and inspects for bridging between adjacent solder depositions. Furthermore, the MS-11e provides real-time closed-loop feedback to the screen printing system to effectively eliminate defects before they occur!
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry. For further information, please visit www.mirtec.com.