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At the recent SMTA International exhibition in Chicago, Tim O’Neill, technical marketing manager for AIM Solder, speaks with I-Connect007’s Andy Shaughnessy about the biggest problems related to solder paste printing in a typical manufacturing process—and how their M8 no-clean solder paste is helping address these issues.
He also talks about solder jetting technology and why it is getting widespread acceptance, as well as their latest J8 no-clean jetting solder paste that is suitable for this process.
Watch The Interview Here
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.
Gustaf Mårtensson and Thomas Kurian, Micronic Mydata AB
Among the alternatives for the deposition of solder paste and other fluids on a PCB is jetting, which offers advantages concerning precise volume repeatability, software control and local volume control. The goal of this study is to examine the effect of piezo actuation profile on deposit quality with respect to positioning, shape and satellite levels in order to achieve adequate deposition quality for applications such as 0.4 mm BGA.