Reading time ( words)
At the recent SMTA International exhibition in Chicago, Tim O’Neill, technical marketing manager for AIM Solder, speaks with I-Connect007’s Andy Shaughnessy about the biggest problems related to solder paste printing in a typical manufacturing process—and how their M8 no-clean solder paste is helping address these issues.
He also talks about solder jetting technology and why it is getting widespread acceptance, as well as their latest J8 no-clean jetting solder paste that is suitable for this process.
Watch The Interview Here
Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.
Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.
Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.