Indium Corporation to Present at NEPCON Vietnam 2016


Reading time ( words)

Indium Corporation experts will share their knowledge and expertise at NEPCON Vietnam, which is scheduled to be held from October 6–8, in Ho Chi Minh City, Vietnam.

Jonas Sjoberg, Technical Manager, will present "DfX for High-Density Assemblies," which covers the basic principles and understanding of manufacturability (DfM) and reliability (DfR). 

Participants will learn the importance of understanding process and design and how they impact manufacturing yields, reliability, and total cost. Lessons will include real-world case studies, with fundamental consideration and mechanisms of challenges well illustrated.

James Duong, Area Technical Manager, Vietnam, will discuss how to "Avoid the Void." Voiding reduces the electrical conductivity and physical strength of the solder joint and interferes with the component’s thermal management capabilities. Indium Corporation researched this defect extensively and, as a result, created Indium 10.1 and Indium 8.9HF solder pastes to minimize voiding and increase product reliability.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

Share

Print


Suggested Items

SMTAI 2019: Chris Bastecki on Low-temperature Solder Challenges and Products

10/14/2019 | Real Time with...SMTAI
Chris Bastecki, director of global PCB assembly at Indium Corporation, discussed challenges of low-temperature solder and the company's new product, Durafuse LT, which provides novel properties and reliability.

Real Time with... SMTAI 2019 Video Interviews

10/09/2019 | Real Time with...SMTAI
The SMTA International Conference and Exhibition 2019, which took place September 22–26, 2019, at the Donald E. Stephens Convention Center in Rosemont, Illinois, concluded successfully. For those of you who were not able to make it to the show, catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, so check it out!

SMTAI 2019: Happy Holden’s On-the-Scene Report

10/03/2019 | Happy Holden, I-Connect007
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.



Copyright © 2019 I-Connect007. All rights reserved.