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AIM Solder will highlight their innovative M8 No Clean Solder Paste along with their full line of solder assembly materials at the SMT – info Technical Conference, scheduled to take place October 18th – 19th, 2016 in Brno, Czech Republic.
M8 No Clean Solder Paste has been formulated to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on QFN and LED packages. M8's post-reflow residue passes all IPC, BONO and tough changing environment test specifications, making it the ideal choice for automotive and high performance/high reliability applications.
Additionally, AIM’s Vice President of Technology, Karl Seelig, will be presenting at the SMT – info International Technical Conference on October 19th, 2016. Seelig’s presentation will be on the effects of bismuth (Bi) content on properties of low-silver SAC solders. His presentation will cover deficiencies and negative implications associated with the use of SAC305 due to increased demand on electronic applications for portable devices, as well as the effects of Bi content on soldering and mechanical performance of reduced silver SAC Alloys.
To discover all of AIM’s products and services, visit the company at the SMT – info International Technical conference for more information.
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.