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At the recent SMTA International event in Rosemont, Illinois, Brian D'Amico, president of Mirtec, discusses with I-Connect007’s Andy Shaughnessy why more and more manufacturers are adopting 3D inspection technologies, such as 3D AOI and 3D SPI systems. He also mentions the increasing use of very small components, such as the 0201s and 01005s—and the advent of the 03015s.
"What 3D does for us is it allows us to measure the solder joint, how high the solder has crept up, and do full analysis. From a metrology point of view, we know exactly the dimensions—the x, y, z elements—for 3D. That’s the advantage of 3D. It guarantees that you are making boards correctly, maximizing your efficiency, and minimizing waste," says D'Amico.