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At the recent SMTA International event in Rosemont, Illinois, Brian D'Amico, president of Mirtec, discusses with I-Connect007’s Andy Shaughnessy why more and more manufacturers are adopting 3D inspection technologies, such as 3D AOI and 3D SPI systems. He also mentions the increasing use of very small components, such as the 0201s and 01005s—and the advent of the 03015s.
"What 3D does for us is it allows us to measure the solder joint, how high the solder has crept up, and do full analysis. From a metrology point of view, we know exactly the dimensions—the x, y, z elements—for 3D. That’s the advantage of 3D. It guarantees that you are making boards correctly, maximizing your efficiency, and minimizing waste," says D'Amico.
Watch the interview here.
Richard Barratt, JJS Manufacturing
The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.
Barry Matties, I-Connect007
Mycronic recently announced the acquisition of Vi TECHNOLOGY, with the intent of combining VIT’s inspection technology with Mycronic’s jetting capabilities. In an interview with I-Connect007, Olivier Pirou, Managing Director of VIT, discusses more about the merger and how this will help VIT contend in such a competitive environment.
Neil Sharp, JJS Manufacturing
In today's increasingly competitive manufacturing environment, it's crucial that you are able to produce high quality new products that can be delivered on time, at the volumes required and at the right cost. And the key to ensuring a smooth transition from the initial design through to final manufacture is the implementation of a new product introduction (NPI) process.