-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Dr. Jennie Hwang to Address Solder Joint Reliability and Role of Intermetallic Compounds at IMAPS
October 6, 2016 | Dr. Jennie S. Hwang, H-Technologies GroupEstimated reading time: 1 minute
Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products from commercial to military from computing to smartphone from medical to avionic applications. In lead-free electronics, intermetallic compounds become increasingly important to the performance and reliability of solder interconnections in the chip level, package level and board level. Understanding the essential fundamentals and key factors behind intemetallics and solder joint reliability is a necessity to designing and manufacturing reliable products.
On October 10, Dr. Jennie S. Hwang leverages decades of extensive real-world experiences and deep knowledge of the industry by presenting on solder joint reliability and the role of intermetallic compounds at the upcoming IMAPS 2016 (49th International Symposium on Microelectronics) event, which will be held from October 10–13 in Pasadena, California. Dr. Hwang will discuss relevant aspects of solder joint reliability at Workshop B1 – "Reliability of Electronics – The Role of Intermetallic Compounds", and Workshop B2 – "Solder Joint Reliability - Principles and Applications". Attendees are encouraged to bring their own selected systems for deliberation.
Workshop B1 topics are as follows:
- Solder joint fundamentals – mechanical properties vs. microstructure evolution vs. services;
- Solder joint thermo-mechanical behavior and degradation – fatigue and creep interaction;
- Solder joint failures modes - interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surface-crack, and others;
- Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture;
- Solder joint strengthening metallurgy;
- Power of metallurgy for increased fatigue resistance and creep resistance;
- Distinctions and commonalties between Pb-free and SnPb solder joints;
- Thermal cycling conditions - effects on test results and test results interpretation;
- Testing solder joint reliability – discriminating tests and discerning parameters;
- Solder joint performance in harsh environments;
- What are on the horizon and what impact will be on reliability- present vs. future system;
- Best practices – competitive manufacturing (yield, cost, reliability);
- Ultimate reliability.
Workshop B1 topics are as follows:
- Intermetallic compounds – definition, fundamentals, and characteristics;
- Intermetallic compounds in the intrinsic material- Pb-free vs. SnPb;
- Formation and growth during production process and in product service life;
- Different types of intermetallic compounds – effects on solder joint reliability;
- Intermetallic compounds - at-interface vs. in-bulk;
- Effects from substrates (hybrid module thick film pads, PCB surface finish) + component coating;
- SAC alloys incorporated with various doping elements – characteristics, performance;
- Effects on failure mode;
- Effects on reliability.
For more information or to register, visit http://www.imaps.org/imaps2016/pdcs.htm#b1 and http://www.imaps.org/imaps2016/pdcs.htm#b2.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.