AIM to Highlight M8 at SMTA Long Island Expo & Tech Forum


Reading time ( words)

AIM Solder is pleased to announce their participation at the SMTA Long Island Expo & Tech Forum, scheduled to take place October 26th, 2016 at the Hyatt Regency Long Island in Hauppauge, New York. AIM will highlight their revolutionary M8 solder paste along with their full line of solder assembly materials. 

M8 No Clean Solder Paste has been formulated to address the most demanding requirements confronting today’s SMT assembly market. M8 is proven to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on QFN and LED packages.  M8's post-reflow residue passes all IPC, BONO and tough changing environment test specifications, making it the ideal choice for automotive and high performance/high reliability applications. M8’s robust characteristics and stable performance improves every facet of the PCB assembly process.

Additionally, AIM will highlight its liquid fluxes, tin/lead and lead-free alloys, including SN100C. To discover all of AIM’s products and services, including lead-free and halogen-free solder, visit the company at the SMTA Long Island Expo & Tech Forum for more information. 

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. 

Share

Print


Suggested Items

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

eSMART Factory Conference 2019, Day 2

09/04/2019 | Happy Holden, I-Connect007
Happy Holden continues his report on the the eSMART Factory Conference Dearborn, Michigan, with highlights from the event's second day, which includes a keynote from Brian Toleno titled "Augmented Reality: Next-Generation Computing for Front-Line Workers."

Conformal Coatings

08/01/2019 | Nolan Johnson, I-Connect007
While conformal coatings may have been something of an afterthought at the front of the design process, that can no longer be the case. Conformal coatings are now a critical part of any board assembly that might be subjected to challenging conditions. But coatings can also contribute to increased mean time between failure in any conditions, even environmentally controlled environments.



Copyright © 2019 I-Connect007. All rights reserved.