SHENMAO Technology to Present on No Clean Flux in Fine-pitch Flip Chip Interconnect at IWLPC 2016


Reading time ( words)

For several years, an approach to use fine-pitch flip chip package (<150um) with copper pillar/ micro-bump is for the realization of 2.5D/3D packages of higher density and performance enhancement. Generally, flux is widely used to clean the surfaces to be soldered for good wetting and form reliable joints. The upcoming concerns about fluxes are clean-ability for fine-pitch package, voiding and compatibility with underfill materials. There is a tradeoff between flux characteristics and soldering performance.

At the upcoming 13th International Wafer Level Packaging Conference (IWLPC), SHENMAO Technology Inc. will present a paper on a formulated no clean flux for fine-pitch flip chip package of copper pillar/micro-bump interconnect. This paper will discuss in details about the applicability of a new no clean flux in fine-pitch flip chip interconnect from the point of view of flux formulations, including flux activity for wetting performance, rheological characterization for the study of behaviors during reflow process and the evaluation of compatibility with underfill.

Authored by Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, and Watson Tseng, the paper will be presented during the Interactive Presentations session on October 18, 10:00 am to 1:30 pm.

Share

Print


Suggested Items

The Convergence of 5G and Automotive

01/08/2020 | Barry Matties, I-Connect007
Karthik Vijay is head of the applications engineering team for customers in Europe at Indium Corporation. He spoke with Barry Matties about what EMS or assemblers for automotive should consider, as well as how he thinks 5G will affect the marketplace and manufacturing.

SMTA 2019 International Awards

09/30/2019 | Nolan Johnson, I-Connect007
The SMTA International conference—held September 22–29, 2019, at the Stephens Convention Center in Rosemont, Illinois—honored industry members with awards for their contributions to the industry. I-Connect007 has compiled an unofficial list of award recipients. The official list from SMTA will be released shortly, and I-Connect007 will publish it as soon as it is available.

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.



Copyright © 2020 I-Connect007. All rights reserved.