SHENMAO to Present at 2016 IMPACT-IAAC Joint Conference in Taiwan


Reading time ( words)

SHENMAO Technology Inc. will present a paper on a formulated no clean flux for fine-pitch flip chip package of copper pillar/micro-bump interconnect at the upcoming 2016 IMPACT-IAAC Joint Conference, which will be held in conjunction with the TPCA Show 2016 on October 26–28, 2016 at the Taipei Nangang Exhibition Hall in Taiwan.

The paper, authored by Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, and Watson Tseng, will discuss in details about the applicability of a new no clean flux in fine-pitch flip chip interconnect from the point of view of flux formulations, including flux activity for wetting performance, rheological characterization for the study of behaviors during reflow process and the evaluation of compatibility with underfill.

For more information, contact SHENMAO Technology Inc. at +886-3-416-0177, e-mail solder@shenmao.com or visit www.shenmao.com.

Share

Print


Suggested Items

Solder Paste Printing From the Stencil’s Perspective

02/19/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

Blackfox Trains Veterans for Good Manufacturing Jobs

02/18/2020 | Real Time with...IPC
Blackfox Training Institute has been training manufacturing technologists for over 20 years. Based in Longmont, Colorado, Blackfox is now focused on helping veterans of our armed services transition into good jobs in the manufacturing sector. During IPC APEX EXPO 2020, Editor Nolan Johnson spoke with Blackfox CEO Al Dill about the company's veteran training programs, and how this effort is helping companies fill jobs that might otherwise go unfilled.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.



Copyright © 2020 I-Connect007. All rights reserved.