-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Pickering Present Ultra-high Density Reed Relays at ITC
October 14, 2016 | Pickering ElectronicsEstimated reading time: 1 minute
The Pickering Series 115, Series 116 and Series 117 are three ranges of small Single Pole (1 Form A) reed relays ideal for the construction of high density matrices or multiplexers. These three ranges have identical pin configurations allowing a common PCB for all types but allowing the designer a range of switch ratings according to which part is fitted. The reed switches are vertical within the package which permits a common footprint with a board area of only 3.8mm x 6.6mm. Only the profile height changes with the increasing power or current ratings.
The Series 117 has a height of 9.5mm and is rated at 0.5 Amps switching at 5 Watts. The Series 116 has a height of 12.5mm and is rated at 0.5 Amps switching at 10 Watts. The Series 115 has a height of 15.5mm and is rated up to an impressive 1.0 Amp switching at 20 Watts. Double pole (2 Form A) versions are also available in the Series 116 and 117.
One benefit of the very small size of these relays is that it often makes it possible to increase the functionality of existing designs without increasing the size of the printed circuit boards.
All feature instrumentation grade reed switches with sputtered ruthenium contacts, making them an ideal choice for low level or ‘cold’ switching applications.
They have the option of an internal diode across the coil connections for Back EMF suppression and feature Pickering unique SoftCenter construction as well as an internal mu-metal magnetic screen. Mu-metal has the advantage of a high permeability and low magnetic remanence and eliminates problems that would otherwise occur due to magnetic interaction. Relays of this size without magnetic screening would be totally unsuitable for applications where dense packing is required.
To learn more visit Pickering on booth 216 at ITC this November, or contact Pickering today to request your free sample board of Pickering ultra-high density Reed Relays, click here.
Suggested Items
Demand for NVIDIA’s Blackwell Platform Expected to Boost TSMC’s CoWoS Total Capacity by Over 150% in 2024
04/16/2024 | TrendForceNVIDIA’s next-gen Blackwell platform, which includes B-series GPUs and integrates NVIDIA’s own Grace Arm CPU in models such as the GB200, represents a significant development.
Synaptics Astra AI-Native IoT Platform Launches with SL-Series Embedded Processors and Machina Foundation Series Development Kit
04/08/2024 | SynapticsSynaptics® Incorporated launched the Synaptics Astra platform with the SL-Series of embedded AI-native Internet of Things (IoT) processors and the Astra MachinaTM Foundation Series development kit.
Amphenol Announces Pricing of Senior Notes Offering
04/05/2024 | Amphenol CorporationAmphenol Corporation announced the pricing of its offering of $450 million aggregate principal amount of senior notes due 2027, $450 million aggregate principal amount of senior notes due 2029 and $600 million aggregate principal amount of senior notes due 2034.
Now Available: Episode 4, Season 2 of Designing for Reality—Lamination
04/04/2024 | I-Connect007I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.
ICAPE Webinar: Want to Know How to Order PCBs in 5 Minutes?
03/28/2024 | ICAPE GroupIn today's fast-paced world, efficiency is key. Nowhere is this more evident than in the realm of PCB procurement. But what if we told you that ordering PCBs could be as easy as a few clicks and take just 5 minutes?