Electrolube Launches New Resin and Thermal Management Solutions for LEDs


Reading time ( words)

With the rapid growth of the LED market, correct product selection is imperative to ensure LED performance and lifetime. Electrolube, an established global manufacturer of electro-chemicals, has developed a number of key new products to help LED manufacturers improve upon the thermal management of LED products and ensure the desired results for heat dissipation are achieved.

Electrolube’s newest innovations include ER2224, a thermally conductive epoxy resin system, which offers an improved method of cure and subsequent health and safety benefits for the user. Providing high thermal conductivity and excellent thermal cycling performance, the ER2224 resin is ideal for use in LED lighting units where it helps to promote heat dissipation and prolong unit service life.

The tough new UR5638 polyurethane resin provides a clear, transparent finish and is a low exotherm resin, making it ideal for LED applications involving the encapsulation of larger LED lighting units. As an aliphatic polymer, the resin also offers superior UV stability as well as excellent transmission of visible light, making it an excellent resin for white light LEDs.

UR5639 has been designed to encapsulate a variety of electrical components, but is particularly suited to LEDs. UR5639 is a clear/transparent polyurethane resin featuring low exotherm, low viscosity, low hardness and high flexibility. The level of flexibility achieved by the cured resin means that the connecting legs of components are not placed under high levels of stress during the cure.

Designed for use between heat generating components and heat sinks, the highly flexible GP300S and GP500S Thermal Gap Pads provide excellent thermal conductivity with a wide operating temperature range. With an operating temperature range from -50 to +160, both gap pads are ideal for applications where rapid and efficient heat removal is required and can be cut to any size. GP300S provides thermal conductivity at 3.00 and GP500S provides higher thermal conductivity at 5.00.

Electrolube will also launch two new silicone-free thermally conductive phase change materials. TPM350 provides low thermal resistance, excellent reliability and is exceptionally easy to apply. The material is similar to grease but without the mess and pump-out and is also dry to the touch, which is particularly useful for pre-apply applications. The TPM550 material features high thermal conductivity of 5.5 W/m.K and becomes workable at approximately 45°C. Its advanced formulation ensures minimal contact thermal resistance and TPM550 also produces no mess due to its thixotropic characteristics, which prevent flow outside of defined interfaces.

Ron Jakeman, Managing Director of Electrolube, comments, “Due to the design freedom an LED offers, applications are becoming more diverse and challenging. We are delighted to launch our innovative LED protection solutions, which uniquely combine both the desired aesthetic affect with the capacity to extend the reliability and lifetime of the LED product.”

The company’s newest LED products will be launched at electronica 2016, the world's leading trade fair for electronic components, systems and applications, which takes place on the 8-11 November in Munich, Germany. Further information about Electrolube’s newest solutions for LED manufacturers can be found online at www.electrolube.com or by visiting the company’s experts at the show (Hall A6, stand 214).

Share

Print


Suggested Items

LPKF on Stencils and Depaneling

02/11/2020 | I-Connect007 Editorial Team
Stephan Schmidt and Mirela Orlowski of LPKF Laser & Electronics North America discuss laser technology in cutting stencils and depaneling circuit boards as a factor in shrinking component sizes and why few people in the industry realize how much of an impact the stencil can have on the manufacturing line.

Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad

12/16/2019 | Alfredo Garcia, et al, Sanmina and Nokia
The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.

Dispensing EMI Shielding Materials: An Alternative to Sputtering

08/23/2019 | Garrett Wong, Nordson Asymtek and Jinu Choi, Henkel Electronic Materials Llc
Shielding electronic systems against EMI has become a hot topic. Technological advancements toward 5G standards, wireless charging of mobile electronics, in-package antenna integration, and SiP adoption are driving the need to apply more effective EMI shielding and isolation to component packages and larger modules. For conformal shielding, EMI shielding materials for exterior package surfaces have mostly been applied with a PVD process of sputtering, leveraging front-end packaging technologies to back-end packaging applications.



Copyright © 2020 I-Connect007. All rights reserved.