Nordson EFD Introduces New Precision Fluid Dispensing Guide for Mobile Devices & Wearables


Reading time ( words)

Nordson EFD, a Nordson company has just released a new guide, “Nordson EFD Solutions: Fluid Positioning & Precision Dispensing in Mobile Device and Wearables Manufacturing.” It features the innovative dispensing solutions available to help manufacturers meet growing consumer demand for thinner, lighter, and more sophisticated, yet durable electronic devices at lower costs.

The guide covers a number of applications common to the industry, including:

  • Display applications such as bonding cover glass to LCDs and OLEDs
  • Optical bonding and seal bonding with anisotropic conductive fluids
  • Camera module applications such as frame bonding and IR cut filter bonding
  • Microspeaker applications such as membrane bonding
  • Hydrophobic coating during final assembly
  • Conformal coating microchip leads and printed circuit boards (PCBs)
  • Soldering RF shields onto MEMS microphones with dispensable solder paste
  • Applying thermal compound to heat sinks for central processing units (CPUs)

Nordson EFD provides market-leading dispensing solutions ranging from needle valves that dispense micro-deposits as small as 0.15 mm in diameter to jet valves that meet tight tolerances in terms of precise, repeatable deposit volumes, dimensions, and patterns at speeds up to 1000Hz continuous.

When paired with EFD’s automated dispensing robots, which combine easy-to-use proprietary dispensing software with fully integrated vision systems and up to +/- 0.004 mm positional repeatability, it is possible to optimize production processes.

“At Nordson EFD, we leverage more than 50 years of fluid application knowledge in every precision dispensing solution we develop,” said Rhonda Mitchell, Global Marketing Communications Manager at Nordson EFD. “For the mobile devices and wearables industry, that knowledge results in exceptionally accurate, repeatable dispensing outcomes that meet the stringent requirements necessary to effectively meet consumer demand.”

About Nordson EFD

Nordson EFD designs and manufactures precision fluid dispensing systems for benchtop assembly processes and automated assembly lines. By enabling manufacturers to apply the same amount of adhesive, lubricant or other assembly fluid to every part, every time, EFD dispensing systems are helping companies in a wide variety of industries increase throughput, improve quality, and lower their production costs. Other fluid management capabilities include high-quality syringe barrels and cartridges for packaging one- and two-component materials, along with a wide variety of fittings, couplers and connectors for controlling fluid flow in medical, biopharmaceutical and industrial environments. The company is also a leading formulator of specialty solder pastes for dispensing and printing applications in the electronics industry.

About Nordson Corporation

Nordson engineers, manufactures, and markets differentiated products and systems used for dispensing and processing adhesives, coatings, polymers, sealants and biomaterials; and for managing fluids, testing and inspecting for quality, treating surfaces and curing. These products are supported with extensive application expertise and direct global sales and service. We serve a wide variety of consumer non-durable, consumer durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, building and construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries.

Share

Print


Suggested Items

Oren Manor on the Siemens-Mentor Integration

11/26/2019 | Real Time with...productronica
In this video interview, part of the productronica coverage, the I-Connect007 team speaks with Oren Manor, director of business development for Siemens, in the Siemens booth. Oren introduces us to the in-booth production equipment that integrates factory automation, motion controls, and MES solutions. He points out that the recent effort to automate SMT lines is now expanding into the areas of final assembly, box build, and manual assembly as well.

Meet Zulki Khan, SMT007 Columnist

10/25/2019 | I-Connect007
Meet Zulki Khan, one of our newest SMT007 columnists! Khan’s columns address new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.



Copyright © 2020 I-Connect007. All rights reserved.