Session 4 of IPC/SMTA Conference to Focus on Ultra-Thin or Nanocoatings


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Industry-leading associations IPC and SMTA jointly present the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Session 4 on Thursday, October 27 will focus on “Ultra-Thin or Nanocoatings in Electronics Assembly Operations.”

  • Amanda Rickman, Process Engineer at Rockwell Collins, will focus on conformal coating for Class 3 hardware.
  • Kailey Bradt, Chemical Engineer at Dry Wired, will focus on optimization of industrial process parameters for Ultra-Thin Film Nanocoatings.
  • Dave Hillman, Principal Materials & Process Engineer at Rockwell Collins will focus on the impact of improper conformal coating processes on Lead-free BGA solder joint integrity.

Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.

The link provides a detailed conference agenda. 

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