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Session 4 of IPC/SMTA Conference to Focus on Ultra-Thin or Nanocoatings
October 20, 2016 | IPCEstimated reading time: Less than a minute
Industry-leading associations IPC and SMTA jointly present the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Session 4 on Thursday, October 27 will focus on “Ultra-Thin or Nanocoatings in Electronics Assembly Operations.”
- Amanda Rickman, Process Engineer at Rockwell Collins, will focus on conformal coating for Class 3 hardware.
- Kailey Bradt, Chemical Engineer at Dry Wired, will focus on optimization of industrial process parameters for Ultra-Thin Film Nanocoatings.
- Dave Hillman, Principal Materials & Process Engineer at Rockwell Collins will focus on the impact of improper conformal coating processes on Lead-free BGA solder joint integrity.
Come learn about these valuable lessons and more at the IPC/SMTA Cleaning and Conformal Coating Conference.
The link provides a detailed conference agenda.
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New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
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