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A New Dispensing Solder Paste for Laser Soldering Technology

07/20/2016 | Watson Tseng, et al., Shenmao America Inc.
A new solder paste of alloy composition of Sn-3.0Ag-0.5Cu in a dispensing way is developed for the automatic laser soldering processes. This paper presents the results of soldering BGA spheres on circuit boards with minimal voiding and no splash or solder balling issues.

Shenmao America to Showcase Water Soluble Flux at the SEMICON West

07/11/2016 | SHENMAO America Inc.
Shenmao America Inc. will introduce its SMF-WB02/SMF-WB51 Water Soluble Flux at the SEMICON West event happening this week (July 12–14) at the Moscone Center in San Francisco, California.

Shenmao America Intros BGA and Micro BGA Bumping Solder Paste as SEMICON West 2016

07/07/2016 | SHENMAO America Inc.
Shenmao America will showcase its bumping solder paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) at the SEMICON West 2016 event happening from July 12–14 in San Francisco, California.
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