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SHENMAO America Inc. will be showcasing its semiconductor packaging materials at the upcoming MEPTEC Semiconductor Packaging Roadmap Symposium, which will be held on November 14, 2016 at the Holiday Inn Silicon Valley San Jose in California.
SHENMAO is one of the world’s major provider of solder materials such as semiconductor packaging solder spheres, package-on-package solder paste, bumping solder paste, dipping flux, SMT solder paste, low and high temperature solder paste, solder preform, wave solder bar, solder wire and flux.
SHENMAO America will be at Booth 17.
For more information, please contact SHENMAO America Inc. at +1-408-943-1755 or e-mail firstname.lastname@example.org.