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Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be hosting a workshop on LED Interconnects for Die Packaging and Luminaire Assembly during the second annual LED Assembly, Reliability & Testing Symposium organized by SMTA that will be held on November 29th in Atlanta, Georgia.
The workshop is intended to dicuss interconnects at die level (Level 1, die attach), package on board (Level 2, light engine assembly) as well luminaire level (Level 3, retrofit bulbs / tubes etc). Interconnect materials as well as thier end-use application and process methods (die attach processes, SMT assembly, soldering etc) will be discussed. Finally, optical and thermal characterization methods for LED packages (light output, color measurement etc) will be covered.
In addition, Alpha Assembly Solutions, a part of the MacDermid Performance Solutions group of businesses, has three technical paper presentations taking place during the event that will highlight findings and insights with the industry regarding the reliability assessment and qualification of LED lighting products and potential solutions.
Amit Patel, Project Manager, Engineer – LED for Alpha, will present his paper, Impact of Interconnects for LEDs on Flexible Substrates which focuses on a structured study to understand the contribution of solder alloys to overall LED-on-flex assembly reliability. LED performance was characterized at a range of operating currents by junction temperature, thermal resistance, total luminous flux, color-correlated temperature (CCT), efficacy, and wall plug efficiency.
Gyan Dutt, Technical Marketing Manager – LED for Alpha will present his paper, High Temperature Characterization of High Reliability Creep Resistant Interconnects for Outdoor Lighting Applications in which high temperature operation of outdoor high power LED systems was simulated to study the high temperature stability of lead-free solders interconnects. The solder mechanical and microstructure characterization results will be correlated with creep resistance and thermo-cycling performance of interconnects in high power ceramic LED assemblies.
Nicholas Herrick Scientist – LED for Alpha will present his paper, Thermal, Optical, and Electrical Performance of LED Die Attach Materials. High-power LEDs generate significant heat that, if not efficiently removed from the assembly, leads to lower luminous flux and lower operating efficiency. High thermal conductivity die attach materials significantly decrease the thermal resistance of an LED stack, thereby prolonging LED lifespan and increasing performance or electrical efficiency. Nicholas will present measurements of Alpha’s solder, silver-filled epoxy, and sintered silver products as used with high-power LEDs and discuss motivations behind die attach product choices for end users.
To receive information on ALPHA® LED Product Technologies, be sure to visit Alpha during the SMTA LED A.R.T. Symposium or visit our site at AlphaAssembly.com.
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
Gyan Dutt - Biography
Gyan Dutt is Technical Marketing Manager – LED for Alpha. He is responsible for LED portfolio management and market development at Alpha. He has experience in technical marketing, product development and applications engineering roles in semiconductor packaging in the US and Asia-Pacific region. He co-chairs the iNEMI Solid State Illumination Technology Working Group for the 2015 roadmap cycle and is a member of the SMTA Technical Committee for the LED A.R.T. Symposium. Gyan has an MS in Polymer Engineering from the University of Tennessee in Knoxville and an MBA from the University of California in Los Angeles, Anderson School of Management.
Amit Patel - Biography
Amit Patel is the Project Manager - Engineer, for the LED Technologies division at Alpha Assembly Solutions, South Plainfield, NJ. In his current role he is instrumental in planning, coordinating and executing market research, and applications research for the design and implementation of electronic assembly materials for all levels of LED manufacturing, from LED die attach to module/luminaire assembly. Amit holds a Bachelor’s degree in Electrical Engineering from The New Jersey Institute of Technology. He is also an Alent trained Six Sigma Black Belt. He co-wrote the iNEMI Solid State Illumination Technology Working Group for the 2015 roadmap cycle So far, He has published 4 papers in the areas covering Assembly Processes, Thermal Management and Reliability for the solid state lighting industry.
Nicholas Herrick – Biography
Nicholas Herrick – Scientist, R&D Alpha Assembly Solutions. Nicholas is an LED packaging & instrumentation scientist located in South Plainfield, NJ. He develops tests and equipment for measuring the thermal, electrical, and optical performance of LEDs and supervises packaging, measurement and aging tests in Alpha’s LED laboratories. Nicholas also builds novel mechanical, chemical, and optical test equipment for Alpha’s other diverse products, ranging from laser soldering robots and water quality analysis to flux thickness inspection and mechanical bending fatigue tests. He has a degree in applied physics from Brigham Young University.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.