November 2016 Issue of SMT Magazine Available Now

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The November 2016 issue of SMT Magazine looks into the impact of vias—blind and buried—on PCB assemblies. It highlights the challenges in and benefits of using vias, and how electronics assemblers can address their issues when dealing with vias.

Read the November issue of SMT Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.

03/04/2020 | I-Connect007 Editorial Team

Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?

02/26/2020 | I-Connect007 Editorial Team

Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.

12/11/2019 | Barry Matties, I-Connect007

Barry Matties spoke with Gen3’s Andrew Naisbitt about what readers should know about SIR and CAF testing, what to consider if you’re thinking of bringing it in-house, and how reliability testing fits into automotive and the digital factory.