EIPC SpeedNews: News from the European PCB Industry


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News from the EIPC

- Rückblick Electronica 2016

- EIPC Winter Conference Salzburg, February 2–3, 2017

- EIPC Workshop on PCB Bio-MEMs, London Heathrow, December 8th

- Call for papers ECWC14, Korea, 25–27 April 2017

News from Germany

- Multiline International Europa LP (MIE LP) and Ventec Europe Announce Cooperation Agreement

- Innovations from Schweizer and Infineon make Matrix LED headlights more compact and affordable

- Schweizer Electronic presents third quarter figures and reports increasing achievements in the automotive sector and export business

News from the UK

- Ventec Secures Exclusive UK Distribution Rights for Advanced Copper Foil Inc. Range of Copper-Aluminium Foil Products

- ICT Conference Majestic Hotel Harrogate, 1st December 2016

- Photonics & Opto-packaging conference

- Next Generation of PCB Surface Finish – Webinar

News from the USA

- Ventec International Appoints Chris Bowles as Technical Account Manager, USA

Electronics Industry News

- Siemens boosts software business with $4.5 billion deal

News from WECC Members

- IPC

Click here for the International Events Diary 2016 

Click here to download the complete SpeedNews Issue 30

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