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KYZEN will exhibit at the LED Assembly, Reliability & Testing (A.R.T.) Symposium, scheduled to take place November 29–December 1, 2016 at the Crown Plaza Midtown in Atlanta, Georgia. Dr. Mike Bixenman, CTO of KYZEN, will be presenting a technical paper co-authored by Mark McMeen from STI Electronics Inc., entitled, “LED Reliability Assessments as a Function of Clean and Not Cleaned Packages” on November 30 at 1:30 p.m.
LED die package factors of higher current density, color uniformity and process residues require an understanding of both assembly and materials to improve reliability of chip on board and flip chip structures. A single LED failure results in a luminaire fail. Residues present on LEDs subjected to high temperature and humidity can impact color intensity, corrosion, poor interfacial bond strengths, insufficient wetting of underfill, leakage currents, electrical noise and field failures.
Cleaning process residues has been reported to improve wire bonding quality, reduce color shifts and prevent electrochemical migration. The test board for this study has sensors placed under and at the peripheral of the die package. The DOE will test leakage currents on both cleaned and uncleaned devices. Inferences from the data findings, conclusions and process recommendations will be reported.
Dr. Bixenman has more than 20 years of experience in the design of electronic assembly cleaning materials and process integration. He was the chair of the 2008 IPC/SMTA Cleaning Symposium and is the current chair of the IPC Cleaning Handbook Task Group. Dr. Bixenman holds four earned degrees including a Doctorate in Business Administration.