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Dymax Multi-Cure 9-20557 Conformal Coating Offers Protection Against Thermal Shock
November 28, 2016 | Dymax CorporationEstimated reading time: Less than a minute
Dymax Multi-Cure 9-20557 is designed for rapid conformal coating of printed circuit boards and other electronic assemblies. This MIL-I-46058C listed product is especially formulated to remain on the edges of difficult-to-wet components and sharp leads, while its low modulus allows it to excel in coating applications where thermal shock performance is critical.
Multi-Cure 9-20557, which is UL approved and meets the IPC –CC-830 standard, has been optimized for coating thicknesses between 51 mic [0.002 in] and 510 mic [0.020 in]. This medium-viscosity material, designed to enhance wetting of leads, is compatible with most types of spray equipment. It fluoresces vivid blue when exposed to UV light (365 nm) for easy inspection of the coating coverage. In addition, its secondary heat-cure feature allows the coating to cure with heat in applications where shadowed areas exist.
Suggested Items
Stan Rak: Elevating the Ideas and Insights of IPC's Thought Leaders Program
04/25/2024 | Stanton Rak, SF Rak CompanyAs a member of the IPC Thought Leaders Program (TLP), I am responsible for identifying knowledge-sharing opportunities that can generate ideas and insights that strengthen the IPC community as well as create a sustainable and lasting future for its members. I am delighted to highlight some of my recent contributions as a member of the TLP.
Alternative Manufacturing Inc. Awarded QML Requalification to IPC J-STD-001 and IPC-A-610
04/24/2024 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) requalification to Alternative Manufacturing Inc (AMI).
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Real Time with... IPC APEX EXPO 2024: A Conversation with IPC's CEO: New Venue, Sustainability, and More
04/23/2024 | Real Time with...IPC APEX EXPOBarry Matties hosts Dr. John W. Mitchell, CEO of IPC, on the final day of IPC APEX EXPO 2024. They discuss the new venue in Anaheim and broach a range of topics, from traffic and booth experiences to workforce development, sustainability, and the CHIPS Act. And they offer advice for newcomers as IPC looks forward to an even better show experience next year.