-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
The Cost of Rework
In this issue, we investigate rework's current state of the art. What are the root causes and how are they resolved? What is the financial impact of rework, and is it possible to eliminate it entirely without sacrificing your yields?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Saki Incorporates 3D AOI, SPI Systems into Fuji America's Smart Factory Line
December 1, 2016 | Saki CorporationEstimated reading time: 1 minute
Saki Corp. has partnered with Fuji America to incorporate its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems into Fuji's Smart Factory SMT line at its Vernon Hills, Illinois facility. Saki's inspection and measurement systems will be used to ensure that the printed circuit boards produced at Fuji adhere to the highest standards of quality and reliability.
"Saki has been on the forefront of innovation for over 20 years, and their inspection systems have played a vital role in the assembly process," said Scott Wischoffer, marketing manager at Fuji America. "As the industry has moved towards the Smart Factory Model and Industry 4.0, our industry partner companies have collaborated to produce an efficient assembly process that will benefit our customers and their customers as well. We are proud to have Saki as part of this Fuji Smart Factory Family."
Saki's BF-3Di AOI system precisely inspects and measures the height of all devices on a printed circuit board and detects defects such as lifted leads, tombstones, reverses, and height variations at high speeds and cycle times. Saki's 3D BF-3Si SPI system is one of the world's fastest 2-projector solder paste inspection systems available. Its Phase Measurement Profilometry with Liquid Crystal on Silicon (LCoS) technology ensures high repeatability of inspection results.
Saki is part of Fuji Machine Manufacturing's Smart Factory with Nexim initiative that standardizes the communication protocol between Saki's SPI and AOI machines and Fuji's component placement machines to create a manufacturing line that extends beyond the boundaries of corporations. This significantly contributes to the production of high quality products and results in a more highly efficient process.
"Saki is pleased to have its AOI and SPI machines installed in the Fuji America Technical Center," said Satoshi Otake, general manager of SAKI America. "It gives us the opportunity to demonstrate the performance and accuracy of our equipment and how it works with Fuji's systems."
About Saki Corp.
Since its inception in 1994, Saki has led the way in the development of automatic recognition through robotic vision technology, applying ground-breaking image processing tools to solve inspection problems associated with printed circuit board assembly. Saki Corporation has headquarters in Tokyo, Japan with offices and sales and support centers around the world. Saki has Quality Management System JIS Q 9001:2008 and ISO 9001:2008 certifications.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.