Indium to Feature New Solder Paste at IPC APEX 2017


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Indium Corporation will feature its void-reducing Indium8.9HF solder paste at IPC APEX Expo on Feb. 11-16 in San Diego, California. 

Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:  

  • Demonstrates consistent printing performance for up to 12 months when refrigerated
  • Maintains excellent printing and reflow performance after remaining at room temperature for one month
  • Delivers excellent response-to-pause even after being left on the stencil for 60 hours 

Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium8.9HF solder paste to reduce voiding significantly below the industry average for improved finished goods reliability. Indium8.9HF delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.

Indium8.9HF has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly.

For more information about Indium Corporation’s low-voiding solder pastes, email askus@indium.com or click here

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