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Indium to Feature No-clean Solder Pastes at NEPCON Japan 2017
December 8, 2016 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at NEPCON Japan 2017 on Jan. 18-20 in Tokyo, Japan.
Indium8.9HF is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
In addition to outstanding print transfer and response-to-pause, this no-clean solder paste remains stable at room temperature for up to 30 days. It can also be stored for up to 12 months at less than 10°C.
Indium8.9HF provides a number of other benefits, including excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window.
Indium8.9HF is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology.
Indium8.9HF Solder Paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void™. For more information about Indium8.9HF, visit our booth W2-68, email askus@indium.com or click here.
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03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
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Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.