Indium Releases New Research Kit for Soldering to Gold


Reading time ( words)

Indium Corporation has released a new solder research kit designed for soldering to gold plating using indium-based alloys.

Gold is often used in electronics assembly because it resists oxidation and solders readily. This makes gold ideal for plating contact surfaces for switches and connectors. The more commonly used tin-based solder alloys rapidly scavenge or dissolve the gold during the reflow process, leading to the destruction of gold conduction patterns. Tin-based alloys also result in crack-inducing platelets within the solidified solder joint. Indium-based alloys, especially those in the indium-lead (InPb) family, cause appreciably less gold scavenging damage than tin-lead (SnPb) solders.

The Soldering to Gold Research Kit allows you to choose three different alloys from seven that are offered for the kit. The alloys come in the form of 0.76mm (0.030”) solid-core wire and represent melting temperatures ranging from 143-310°C. The kit also offers two compatible fluxes - TACFlux®007 and TACFlux 012.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

What’s Driving AOI Innovation and Collaboration?

03/25/2020 | Brent Fischthal, Koh Young America
When we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. For example, solder paste inspection (SPI) has undergone a shift from 2D to 3D because the 2D inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. Thus, companies developed 3D SPI to capture the printed solder paste height to accurately measure the total volume of paste printed. Several years later, we see the same need for surface-mounted component inspection with AOI systems.

AIM Appoints Oscar Hernandez as Sales Manager for Queretaro and Bajio Regions Mexico

03/24/2020 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Oscar Hernandez to the position of Sales Manager for the Queretaro and Bajio regions of Mexico.

Trends From the Show: Solder and Software

03/18/2020 | Nolan Johnson, I-Connect007
In my role as a media representative, my perspective on IPC APEX EXPO may be a bit different from that of many attendees. Since the I-Connect007 team had the opportunity to talk to many attendees and exhibitors and listen to their stories over the course of the week, our view can be particularly wide. When I reflected on all the conversations, pieces from all throughout the week coalesced and provided a different understanding of and takeaway from the show.



Copyright © 2020 I-Connect007. All rights reserved.