Top 10 Most-read SMT Articles of 2016


Reading time ( words)

Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year. Check them out.

1. K&S and Assembléon: A Perfect Marriage of Technology and Services

Jeroen de Groot and Chan Pin Chong of Kulicke & Soffa talk about the company's acquisition of Assembléon and its benefits to their customers. They also discuss the latest innovations happening at the company's product lines and key trends driving their product development strategies.

2. Is Your Electronics Manufacturing Factory 'Smart'?

Despite the amount of content being produced around big data, Industry 4.0, digital manufacturing, mass customization and various other subjects, a large number of electronics manufacturing companies still don't fully understand this question. This article looks to provide guidance on how you can assess your manufacturing facility without investing huge amounts of time and money upfront.

3. Overview Miniaturization on Large Form Factor PCBA

Many of the miniaturization technologies were developed for the consumer market, targeted mainly at the smart phone. Many designers in other areas such as medical and telecom are looking at ways to miniaturize the product or increase the functional density. This article explores some of the common miniaturization technologies and their application to larger form factor boards.

4. Reliability Study of Low Silver Alloy Solder Pastes

This article presents the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes, such as low and no silver solder pastes and a low temperature SnBiAg solder pastes, after thermal cycling tests.

5. The Road Less Traveled (Part 1): Contract Manufacturing Differentiators

The word "differentiator" is tossed around a lot these days in the electronics industry—especially within the contract manufacturing (CM) community. When evaluating a new potential CM partner, decision makers frequently ask: "What would you say differentiates your organization from other contract manufacturers?" This article talks about three powerful and very real difference-makers that would set a CM apart from the competition.

6. OEM Applications: MacDermid’s OEM Director Embraces Renewed Focus

Lenora Toscano, OEM director for MacDermid’s electronics solutions division, discusses the needs of the end-user market of PCBs, her own role at the company, which involves much interaction with OEMs, and the benefits that both she and MacDermid bring to SMTA and IPC meetings.

7. 3D Assembly Processes: A Look at Today and Tomorrow

One of the ways to increase density of a product is to utilize more of the three-dimensional spaces available. This article explores the evolution of 3D assembly techniques, and takes a glimpse into the future, based on technologies available now, to examine potential assembly methods on the horizon for 3D assemblies.

8. Nordson EFD Discusses Dispensing Technologies, Solder Reliability and Innovation

Philippe Mysson, business development manager for solder paste at Nordson EFD, discusses a host of solder-related issues, including reliability, the benefits of solder paste dispensing systems, challenges facing their customers and how Nordson EFD is helping to address those issues, and finally, latest trends driving innovation in solder alloys.

9. Vapor Phase Technology is a Viable Solution, but Carries a Learning Curve

Vapor phase reflow solder technology is a technology that has come of age in an era where its efficiency in reflowing densely packed printed circuit board assemblies is highly valued, since the vapor blanket immersion process ensures perfect wetting and void-free, high-quality solder joints. The challenge is properly sizing the machine to likely workloads and optimizing the necessary profiles. The end result is improved quality, better line flexibility and lower energy consumption.

10. Supplier Spotlight: Transition Automation

In an interview with I-Connect007, Alden Lewis, vice president of sales at Transition Automation, discusses how they are tackling solder paste printing problems with squeegee technologies.

Share

Print


Suggested Items

Emerging Engineers: Raviteja Boyana

04/01/2021 | Raviteja Boyana
Recent engineering graduate Raviteja Boyana discusses IPC's Emerging Engineer program and the IPC Education Foundation Scholarship, along with his mentorship with Gen3's Graham Naisbitt. Ravi has already found a job in the industry with Maxim Integrated.

Catching Up With Sean McConville, Niche Electronics

02/22/2021 | Dan Beaulieu, D.B. Management Group
Dan Beaulieu catches up with Sean McConville, vice president of business development at Niche Electronics, who shares his background in the industry, the strengths of his company, and how the pandemic has affected its business.

Meet Christine Davis, I-Connect007 Columnist

12/23/2020 | I-Connect007 Editorial Team
Meet Christine Davis, one of our newest columnists! Christine will share her expertise and lessons learned through her journey as one of the few women in the electronics industry to found and run her own company.



Copyright © 2021 I-Connect007. All rights reserved.