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Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year. Check them out.
Jeroen de Groot and Chan Pin Chong of Kulicke & Soffa talk about the company's acquisition of Assembléon and its benefits to their customers. They also discuss the latest innovations happening at the company's product lines and key trends driving their product development strategies.
Despite the amount of content being produced around big data, Industry 4.0, digital manufacturing, mass customization and various other subjects, a large number of electronics manufacturing companies still don't fully understand this question. This article looks to provide guidance on how you can assess your manufacturing facility without investing huge amounts of time and money upfront.
Many of the miniaturization technologies were developed for the consumer market, targeted mainly at the smart phone. Many designers in other areas such as medical and telecom are looking at ways to miniaturize the product or increase the functional density. This article explores some of the common miniaturization technologies and their application to larger form factor boards.
This article presents the reliability study of lead-free solder joints reflowed using various lead-free alloy solder pastes, such as low and no silver solder pastes and a low temperature SnBiAg solder pastes, after thermal cycling tests.
The word "differentiator" is tossed around a lot these days in the electronics industry—especially within the contract manufacturing (CM) community. When evaluating a new potential CM partner, decision makers frequently ask: "What would you say differentiates your organization from other contract manufacturers?" This article talks about three powerful and very real difference-makers that would set a CM apart from the competition.
Lenora Toscano, OEM director for MacDermid’s electronics solutions division, discusses the needs of the end-user market of PCBs, her own role at the company, which involves much interaction with OEMs, and the benefits that both she and MacDermid bring to SMTA and IPC meetings.
One of the ways to increase density of a product is to utilize more of the three-dimensional spaces available. This article explores the evolution of 3D assembly techniques, and takes a glimpse into the future, based on technologies available now, to examine potential assembly methods on the horizon for 3D assemblies.
Philippe Mysson, business development manager for solder paste at Nordson EFD, discusses a host of solder-related issues, including reliability, the benefits of solder paste dispensing systems, challenges facing their customers and how Nordson EFD is helping to address those issues, and finally, latest trends driving innovation in solder alloys.
Vapor phase reflow solder technology is a technology that has come of age in an era where its efficiency in reflowing densely packed printed circuit board assemblies is highly valued, since the vapor blanket immersion process ensures perfect wetting and void-free, high-quality solder joints. The challenge is properly sizing the machine to likely workloads and optimizing the necessary profiles. The end result is improved quality, better line flexibility and lower energy consumption.
In an interview with I-Connect007, Alden Lewis, vice president of sales at Transition Automation, discusses how they are tackling solder paste printing problems with squeegee technologies.