Nathan Trotter Acquires LOCTITE Solder Bar Division of Henkel Electronics


Reading time ( words)

Nathan Trotter & Co. Inc. has acquired the LOCTITE solder bar division of Henkel Electronics. Prior to the acquisition, Nathan Trotter produced all LOCTITE solder bar sold in North America on behalf of Henkel Electronics. Effective immediately, LOCTITE solder bar will be produced and sold under the Nathan Trotter name. Nathan Trotter has partnered with E-Tronix as the master representative to facilitate the transition. 

As a result of Nathan Trotter's already large presence in the tin industry, the acquisition is expected to generate significant sales and production efficiencies in the electronics assembly industry for tin/lead and lead-free solder alloys. Purity, performance and quality will remain at the same high standards set forth under the LOCTITE brand, while minimum order quantities will be reduced for the benefit of the customer.

"While we enjoyed our successful relationship with Henkel producing LOCTITE solder bar on their behalf, we look forward to showing the electronics assembly market the benefits of working directly with Nathan Trotter for solder bar and recycling services," said Luke Etherington, Vice President of Nathan Trotter & Co.

About Nathan Trotter & Co.

Founded in 1789, Nathan Trotter has grown to become the largest tin manufacturer in North America. ISO 9001 certified since 1997, Nathan Trotter currently serves the Automotive, Aerospace, Electronics, Plating, and Chemical industries globally.

Operating as the recycling division of Nathan Trotter & Co., Tin Technology and Refining is a world-class secondary tin refiner, serving the electronics assembly and recyclable non-ferrous industries. Tin Tech processes solder dross, solder paste, chunk, ingots, pot dumps, and contaminated debris from electronics assembly and industrial processes.

Share

Print


Suggested Items

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2

04/14/2021 | Brent Fischthal, Koh Young America
A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.

Excerpt: The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 1

04/08/2021 | Brent Fischthal, Koh Young America
Today, optical inspection systems are the preferred solution for in-line quality control in the SMT industry. Systems such as solder paste inspection (SPI) or automated optical inspection (AOI) systems for pre- and post-reflow are almost standard in every production facility.



Copyright © 2021 I-Connect007. All rights reserved.