Reading time ( words)
Libra Industries, a privately held electronics manufacturing services (EMS) provider, has announced that Glenn Watson, quality manager at its Dallas facility, recently completed his AS9100 Aerospace Quality Management Systems Lead Auditor training. The RABQSA-Certified training course was offered by AXEON and certified by Exemplar Global.
The course focused on using auditing to improve the organization through understanding quality management principles and interpreting the requirements of ISO 9001 and AS9100. Additionally, the five-day course teaches auditors how to understand system documentation and records, document QMS, and prepare quality policies and objectives.
As a successful graduate, Watson has satisfied part of the knowledge requirements for registering as an Exemplar Global certified AS9100 Aerospace Quality Management System (AQMS) Auditor. This is a key step in Watson becoming an AS9100 Lead Auditor. Even though AS9100 is used as the model for teaching systems and audit, this course enables students to develop and apply auditing skills using any applicable management system standard.
Libra Industries continues to invest to provide customized manufacturing solutions to help make its customers more competitive and improve their profitability. For more information, visit www.libraind.com.
Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
Duane Benson, Screaming Circuits
There are two primary types of causes of board warping: process related at the fab or assembly shop, and layout related issues. If it's warped before assembly, it's between fab and layout. If it's flat before assembly and warped after, it's most likely between layout and assembly. That said, sometimes a fab problem won't show up until a pass through the reflow oven at your assembly partner.
Glen Thomas, Ph.D., and Bill Cardoso, Ph.D., Creative Electron Inc.
As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current X-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials. Will this hold true as they shift to lead-free solder compounds?