Cogiscan Co-NECTs Machines, Software and Enterprise Systems at IPC APEX EXPO 2017


Reading time ( words)

Cogiscan Inc. will introduce its new Co-NECT Production Software in Booth 3132 at the 2017 IPC APEX EXPO, scheduled to take place February 14-16, 2017 at the San Diego Convention Center in California. Cogiscan's Co-NECT is a unique, standalone and neutral connectivity solution that addresses the greatest challenge in the industry at this point: Connectivity between different machines, software and enterprise systems. This technology enables Industry 4.0 for electronics assembly.

Co-NECT supports all existing and future industry standards such as SECS/GEM, CAMX, ZVEI, JSON, as well as proprietary interfaces from leading MES and machines vendors. The Cogiscan Co-NECT connectivity layer enables data exchange in real-time in very large manufacturing sites with hundreds of machines. The architecture and supporting infrastructure is optimized to ensure that there are no delays or any lag in response time, regardless of how many lines / machines / workstations are connected.

Co-NECT is built upon the standard Cogiscan TTC platform that has been around for more than 15 years. It adapts to every customers' environment, regardless of the mix of machines and software solutions already in place. The use of a third-party connectivity middleware means that each customer can keep their options open for the future instead of limiting themselves to a single vendor solution.

About Cogiscan Inc.

Cogiscan is the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry.   The scalable Cogiscan platform perfectly integrates with all major equipment types, and is highly configurable to enable a personalized solution to each customer’s specific production needs.  Since 1999 Cogiscan has attained several international patents for TTC hardware and software, and has won multiple awards throughout the years. For more information, click here.

Share


Suggested Items

The Year of IoT Digitalization

12/15/2017 | Michael Ford, Aegis Software Corp.
There is no longer any significant disagreement that having an industry-wide standard for IoT communication is absolutely essential for digitalization of factories if they are going to deliver on Industry 4.0 performance expectations. Digitalization of manufacturing is the key business opportunity of the decade, whoever and wherever you are, so stand-up and be a part of it, and create your opportunities.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

11/06/2017 | Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.



Copyright © 2017 I-Connect007. All rights reserved.