Cogiscan Co-NECTs Machines, Software and Enterprise Systems at IPC APEX EXPO 2017

Reading time ( words)

Cogiscan Inc. will introduce its new Co-NECT Production Software in Booth 3132 at the 2017 IPC APEX EXPO, scheduled to take place February 14-16, 2017 at the San Diego Convention Center in California. Cogiscan's Co-NECT is a unique, standalone and neutral connectivity solution that addresses the greatest challenge in the industry at this point: Connectivity between different machines, software and enterprise systems. This technology enables Industry 4.0 for electronics assembly.

Co-NECT supports all existing and future industry standards such as SECS/GEM, CAMX, ZVEI, JSON, as well as proprietary interfaces from leading MES and machines vendors. The Cogiscan Co-NECT connectivity layer enables data exchange in real-time in very large manufacturing sites with hundreds of machines. The architecture and supporting infrastructure is optimized to ensure that there are no delays or any lag in response time, regardless of how many lines / machines / workstations are connected.

Co-NECT is built upon the standard Cogiscan TTC platform that has been around for more than 15 years. It adapts to every customers' environment, regardless of the mix of machines and software solutions already in place. The use of a third-party connectivity middleware means that each customer can keep their options open for the future instead of limiting themselves to a single vendor solution.

About Cogiscan Inc.

Cogiscan is the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry.   The scalable Cogiscan platform perfectly integrates with all major equipment types, and is highly configurable to enable a personalized solution to each customer’s specific production needs.  Since 1999 Cogiscan has attained several international patents for TTC hardware and software, and has won multiple awards throughout the years. For more information, click here.


Suggested Items

RTW IPC APEX EXPO: Asteelflash Expansion Plans and Industry Challenges

03/02/2018 | Real Time with...IPC
Mathieu Kury, business development manager at EMS firm Asteelflash, discusses the company's expansion plans and activities amid the growing demand in the automotive electronics space.

Cleaning Trends: The Challenges of Miniaturization and Proximity

11/01/2017 | Patty Goldman, I-Connect007
At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.

Is Hybrid Technology Gaining Momentum?

10/02/2017 | Dieter G. Weiss, Weiss Engineering
Over the past 20 years, ceramic hybrids have changed more and more to a backyard living in the European electronics industry, mainly driven by price pressure, specifically from the automotive electronics industry.

Copyright © 2018 I-Connect007. All rights reserved.