Rehm Presents Innovations at IPC APEX EXPO 2017


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Rehm Thermal Systems once again will be showcasing its latest innovations at the upcoming IPC APEX EXPO 2017 event, which will be held in San Diego, California from February 14-16, 2017. The company will present its latest plant technology for reliable reflow convection and condensation soldering at Booth 1901.

Rehm's new thermal system solutions to be exhibited are as follows:

VisionXP+ Vac: The 2-in-1 solution for reflow convection soldering

The VisionXP+ convection soldering system combines many further developments, in particular with regard to optimizing energy efficiency and reducing emissions. Customers can save up to 20 % energy in electronics manufacturing with this system, consuming an average of 10 tonnes less CO2 per year. The vacuum option makes condensation soldering processes possible with or without vacuum for the first time – all in one system! The VisionXP+ Vac reliably vacuums gas inclusions and voids during soldering while the solder is still in its ideal molten state. With a vacuum of up to 2 mbar, void rates of less than 2 % can be achieved.

Rehm_Vicon.jpgViCON: Simple system operation and optimum process traceability

Rehm presents the new ViCON software in the area of smart data and networking, featuring a touch-screen user interface. The German machine manufacturer has developed an innovative solution for easy operability and optimal traceability in the VisionX series. The software can, for example, monitor all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.

Rehm_Condenso.jpgCondensoXC: top performance for best reflow condensation soldering

Reflow condensation soldering with the CondensoX series carries out the soldering process by means of hot steam and the Galden® medium. Large, heavy boards can be processed without a problem since the heat transfer is up to ten times higher than with convection soldering. The use of the injection principle and the control of temperature and pressure ensure accurate and diverse reflow profiling. Rehm presents the new CondensoXC at the trade fair. The plant is a particularly space-efficient, high-performance system in the CondensoX series and ideal for laboratory applications, small batch production or prototyping. Void-free soldering can be easily implemented in all systems of the series with the vacuum option.

Our Rehm team will be happy to offer you any advice! More information is also available online at www.rehm-group.com and www.ipcapexexpo.org

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