Alpha to Feature New Solder Paste, Preform Innovations at IPC APEX EXPO 2017


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Alpha Assembly Solutions will introduce several new product innovations at the upcoming IPC APEX EXPO 2017 event, to be held from February 14-16, 2017 in San Diego, California.

Alpha, a part of the MacDermid Performance Solutions group of businesses, will feature ALPHA OM-358, the next generation high-reliability Innolot solder paste with ultra-low voiding properties ideal for automotive applications, at Booth 2901. ALPHA Accuflux Preforms, designed specifically for large area power components that require consistent low-voiding solder joints from normal SMT processes, will also be highlighted. 

"Voiding is a critical reliability issue that one can help mitigate by choosing the right soldering materials for your process or application," said Robert Wallace, Regional Marketing Manager for the Americas. "ALPHA OM-358 is ideal for OEM's using high reliability alloys, alloys that historically have produced a larger amount of voids than the SAC family of standard alloys, to reduce the level of voids in the joints close to those achieved in SAC305 while using Innolot/MAXREL/MAXREL Plus alloys and benefitting from all the mechanical properties of these high reliability alloys."

He continues, "Accuflux Preforms also contain an ultra-low voiding flux formulation that is deposited very accurately from preform to preform ensuring repeatable performance every time.  They are available in Tape & Reel for easy assembly in SMT reflow applications."

Also coming soon to market are ALPHA OM-347 Solder Paste, a cleanable, no-clean material with fine feature printing capabilities that is derived from the SAC family of alloys and ALPHA Powerbond Preform Alloys specifically designed for power module assemblies. Powerbond provides higher tensile strength than traditional SAC alloys and thermal fatigue properties moving closer to that of high-lead. More information on ALPHA Solder Paste and ALPHA Solder Preforms can be found on their website.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. 

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands. 

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.  

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.

 

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