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Dymax Corp. will exhibit its newest products and technologies—including solvent free, USP Class VI, and ISO 10993 biocompatible light-curable adhesives formulated with new Encompass technology—at MD&M West, which is scheduled to take place February 7–9, 2017 at the Anaheim Convention Center in Anaheim, California. Dymax will be in Booth 2139.
The company will showcase some of their newest products and technologies including 1405M-T-URSC, an LED-curable adhesive at either 385 nm or 405 nm, that is ideal for fast bonding of plastic-to-plastic and plastic-tometal substrates used in medical device assemblies like needle bonding and blood transfer devices. Formulated with new Encompass technology that combines Dymax exclusive See-Cure color change and Ultra-Red fluorescing technologies with LED-curing capabilities, 1405M-T-UR-SC provides secure bonds with the added benefits of easy cure confirmation and post-cure bond-line inspection.
Visitors to the booth will also see a variety of adhesives for needle bonding, and curing demonstrations featuring the MX - 150, the BlueWave LED flood system, and the BlueWave 200 UV Curing Spot Lamp.