EIPC SpeedNews: News from the European PCB Industry


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News from Germany

- Call for Papers 25. FED-Konferenz, 21 & 22 September 2017

Electronics Industry News

- Robots

- Tech Companies Should Do the Right Thing on Conflict Minerals

News from the UK

- Aerospace Supplier Quality System Certification (AS9100 Rev C) Audit Success at Ventec's UK Facility

- MicroTech 2017 IMAPS-UK Annual Conference “Advanced Packaging & Technology Trends”

- IFS2016 – Semiconductor Market Outlook & Forecast

- ICT Evening Seminar at the Best Western Plus Manor Hotel on March 14, 2017

- Solder Ball Elimination – In Wave, Selective & Reflow Soldering

News from the USA

- Ventec International Expands USA Manufacturing Capacity with Investment in New Equipment

- Affordable Bench-Top X-ray Inspection

- Atotech's sub 20µm universal final finish solution PallaBond at the IPC APEX Expo 2017

News from WECC Members

- News from IPC

Click here for the International Events Diary 2017

Click here to download the complete SpeedNews Issue 3

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IPC Europe Shares Technical Education and Standards Awareness

04/22/2020 | Pete Starkey, I-Connect007
Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.

PCB Surface Preparation Before Solder Mask on Non-copper Finishes

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