SMART Group Releases Conformal Coating & Cleaning Defect Guide 2


Reading time ( words)

SMART Group, Europe's largest technical trade association focusing on surface mount and related technologies, announces the release of its latest color guide, "Conformal Coating & Cleaning Defect Guide 2".

The new guide is free of charge to the industry and provides examples of the most common process defects and common cures. The guide was supported by Humiseal & Electrolube and SMART Group committee appreciates their ongoing support.

The guide also features many of the common as well as less obvious defects seen during production, including those associated with components, printed circuit boards, design, materials, assembly and rework. It also includes some of the issues that are seen on field returns.

SMART Group's first Lead-Free Defect Guide was produced in 2007 and updated in 2008, and was circulated worldwide with more than 1,000 free downloads. The original guide also was provided to engineers to download free. 

To receive a FREE copy of the SMART Group Guides, register here.

Share

Print


Suggested Items

Joe Fjelstad Breaks Down His Occam Process

03/04/2020 | I-Connect007 Editorial Team
Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?

Stencils: Not As Simple As They Seem

02/26/2020 | I-Connect007 Editorial Team
Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.



Copyright © 2020 I-Connect007. All rights reserved.