EIPC SpeedNews: News from the European PCB Industry


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News from Germany

- Atotech to Sponsor ISS Europe 2017

News from Italy

- Gala Dinner Celebrates 30 Years of Seica S.p.A

News from the UK

- More Soldering, Design and Quality Control Events from SMART Group

Electronics Industry News

- The Conflict Minerals Regulation is here to stay

News from WECC Members

Click here for the International Events Diary 2017 

Click here to download the complete SpeedNews Issue 5

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Suggested Items

The Institute of Circuit Technology Autumn Seminar

10/03/2019 | Pete Starkey, I-Connect007
Meriden has been established as a popular Midlands venue for Institute of Circuit Technology (ICT) meetings. On September 19, a multitude of Fellows, Members, and Associates gathered for the Institute’s autumn seminar, which was organised and hosted by ICT Technical Director Bill Wilkie. The agenda included five informative technical presentations, describing current research and development on significant topics relevant to the industry.

SAP Utilizing Very Uniform Ultrathin Copper

08/29/2019 | Steve Iketani and Mike Vinson, Averatek Corporation
The demand for miniaturization and higher density electronic products has continued steadily for years, and this trend is expected to continue, according to various semiconductor technology and applications roadmaps. The semiconductor miniaturization brings significant economic and technical benefits and the semiconductor scale factor becomes the master for the associated package and PCB design.

Solder Mask Curing: UV Bump Overview

08/19/2019 | Nikolaus Schubkegel
Ultraviolet (UV) bump, also called UV cure, is a processing step in which the solder mask pattern is irradiated with ultraviolet and infrared light. This step is performed with special equipment that is built as a continuous flow system, which consists of a conveyor belt and tubular UV lamps mounted above and below the belt. Read on to find out more about this process.



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