Alpha and MacDermid Enthone Electronics Solutions to Participate in Automotive Technology Roadshow


Reading time ( words)

Alpha Assembly Solutions will be showcasing its high reliability products for automotive applications alongside MacDermid Enthone Electronics Solutions (MEES) at the Automotive Technology Roadshow, which will be held from March 7–21.

A part of the MacDermid Performance Solutions group of businesses, Alpha and MacDermid Enthone are global leaders in the development, manufacture and supply of surface coating and joining materials in the Automotive market.

"Alpha Assembly Solutions and MacDermid Enthone Electronics Solutions are uniquely qualified to provide a full range of solutions for automotive applications, from high reliability electronics assembly products to PCB fabrication chemistries and lead-free final finishes," comments Steve Brown, Automotive Electronics Director, MacDermid Performance Solutions.

Alpha will showcase its full range of products for automotive assemblies including ALPHA InnoLot ultra high reliability alloy, which has been designed to withstand the extreme operating temperatures automotive electronics are exposed to within the engine bay. Also to be featured, the ALPHA SBX02 low temperature alloy, which can enable the use of lower cost, lightweight PET flex circuitry for the in-cabin area of vehicles.

The roadshow will travel to top automotive manufacturing sites across the UK and Germany, including Aston Martin, Visteon Engineering Services, Audi and Continental. The roadshow is unique in that it takes manufacturers directly to customers and is aimed at design and development managers, project and R&D Engineers and senior purchasing and management.

Additional information on the Automotive Technology Roadshow can be found at the Dream Marketing website

For more information on Alpha’s Automotive Technologies please visit the Alpha Website.

About MacDermid Performance Solutions

MacDermid Performance Solutions is a global producer of high technology specialty chemicals and provider of technical services. The business involves the manufacture of a broad range of specialty chemicals, created by blending raw materials, and the incorporation of these chemicals into multi-step technological processes. These specialty chemicals and processes are sold into numerous industries including electronics, graphic arts, metal and plastic plating, and offshore oil production and drilling.  For more information, visit www.MacDermid.com.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. 

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.AlphaAssembly.com.

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.