Reading time ( words)
Alpha Assembly Solutions will introduce a range of electronics assembly polymers and high temperature dip tinning technologies at the upcoming Productronica China to be held in Shanghai from March 14–16, 2017.
The polymers being introduced include products ranging from ALPHA STAYCHIP underfills, ALPHA STAYCHIP epoxy flux, ALPHA STAYSTIK low temperature adhesives and other ALPHA STAYSTIK epoxy related materials.
"These products are for applications requiring reinforcement of assembled parts/components, low temperature bonding, UV bonding or dual curing bonding. Selecting the right assembly polymers for your application is critical," said Jimmy Shu, Director of Marketing for the Asia Pacific Region.
"ALPHA SnCX-FT07, SACX0307-FT, SnCu3-FT are lead-free alloys suitable for high temperature dipping and lead tinning applications and are suitable to be adopted under high temperature processes >350°C," said Bernice Chung, Regional Product Manager for Alloys. "The alloys have been engineered to retain a highly reflective solder surface with very minimal surface oxide layer formation after long hours of high heat exposure, as compared to the generic alloys such as SnCu0.7 and SnCu3 alloys. The superior wetting performance of this alloy along with reduced pot maintenance due to low dross rates help improve production yield."
In addition, Alpha will feature a new low temperature solder paste, ALPHA® OM-550 HRL1, that will soon be coming to market. "ALPHA OM-550 HRL1 brings together SAC305-type mechanical and thermal reliability in a low temperature alloy to board level assemblies, which has never been done before," said Phua Teo Leng, Regional Product Manager for Solder Paste. "This material meets reliability requirements typical of motherboard and mobile assemblies, and supports our customers' endeavor to reduce their carbon footprint without impacting performance."
Apart from introducing the above technologies, Alpha will feature ALPHA OM-353 & ALPHA OM-535 lead-free, no-clean solder pastes, and ALPHA EF-2100 liquid soldering flux at their exhibit. To learn more about these materials and all new Alpha products, please visit Alpha at Productronica China 2017, Hall E3, Booth 3146.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet® products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.AlphaAssembly.com.