Goepel Brings Powerful Embedded Test and Programming to Embedded World 2017


Reading time ( words)

State-of-the-art test technologies, powerful test bus simulation for vehicle networks and a broad array of test technologies from a single source: GOEPEL electronic brings Embedded JTAG and Automotive Test Solutions to Embedded World 2017 (Hall 4, Booth 271), for a world premiere. 

basicCAN6153.STM is the new stress and trigger module for CAN FD. It is specifically designed for manipulating CAN / CAN FD communication, enabling accurate protocol tests. The functionality is available as an extended option for the Series 61 communication controllers. 

Goepel2.jpgThe so-called Embedded JTAG Solutions will also be officially introduced for the first time. GOEPEL electronic presents a philosophy that includes complete coverage of JTAG-based test and programming technologies: Embedded Board Test, Embedded Functional Test and Embedded Programming. These elements will provide the most valuable tools for the electronics test challenges of the future. 

Goepel3.jpgNumerous tried-and-tested technologies complete the range of offerings from GOEPEL electronic, with solutions for nearly any problem in the development or production area. These consist of high-speed bit error rate test of interfaces such as USB 3.0, the qualitative testing of high-speed link cables and test and validation of various processors. 

Users from the automotive sector will find a wide range of communication controllers from Series 61. For infotainment test applications, the Video Dragon excels as a frame generator and frame grabber to test high-speed connections. Video sources, such as cameras in driving assistance systems, can easily be linked to a standard PC using EasyCON. 

These and many more products will be exhibited at this year’s embedded world, March 14-16 in Nuremberg.

 

Share

Print


Suggested Items

The Long Road to a New Standard

09/17/2019 | Barry Matties, I-Connect007
Graham Naisbitt, chairman and CEO of Gen3 Systems, has spent decades leading cleanliness testing standards in a number of different standards organizations like IPC, IEC, and ISO around an assortment of testing methods, such as CAF, SIR, and even introducing a new standard this year for his own testing method—process ionic contamination testing (PICT). Naisbitt breaks down his long involvement with standards and where they stand currently.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.



Copyright © 2019 I-Connect007. All rights reserved.