AIM to Participate at Productronica China 2017


Reading time ( words)

AIM Solder is pleased to announce their participation at Productronica China 2017, scheduled to take place March 14-16, 2017 in Shanghai. AIM will highlight its innovative M8 solder paste along with its full line of solder assembly materials. 

AIM will participate at Productronica China for its second consecutive year and will highlight its M8 solder paste, designed for the most demanding high density electronic assemblies. M8 is proven to improve production yields and product quality, whether printing 0.50 area ratios or eliminating voiding on QFN and LED packages. M8's post-reflow residue passes all IPC, BONO and tough changing environment test specifications, making it the ideal choice for automotive and high performance/high reliability applications. M8's robust characteristics and stable performance improves every facet of the PCB assembly process.

Additionally, AIM will highlight its full line of advanced solder materials, including its solder paste, liquid flux and exciting new high reliability alloys. To discover all of AIM’s products and services, visit the company at Productronica China in booth E3-3164.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.

Share

Print


Suggested Items

Meet Zulki Khan, SMT007 Columnist

10/25/2019 | I-Connect007
Meet Zulki Khan, one of our newest SMT007 columnists! Khan’s columns address new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

eSMART Factory Conference 2019, Day 2

09/04/2019 | Happy Holden, I-Connect007
Happy Holden continues his report on the the eSMART Factory Conference Dearborn, Michigan, with highlights from the event's second day, which includes a keynote from Brian Toleno titled "Augmented Reality: Next-Generation Computing for Front-Line Workers."



Copyright © 2019 I-Connect007. All rights reserved.