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Eric Slezak, director of business development at Indium Corp., talks with I-Connect007 Guest Editor Steve Williams about the launch of their new Project 99 wave solder process flux system.
Indium has created an exciting new spin on this technology by using a comic book theme, with “villains” representing common wave solder defects and “superheroes” representing their flux solutions to combat the problems. A refreshing new take that is adding some fun into their science.
Watch The Interview Here
Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.
Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.
Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.