Alpha’s Gyan Dutt and RPI’s Robert Karlicek Co-Chair iNEMI Solid State Illumination Roadmap


Reading time ( words)

Alpha Assembly Solutions and the Lighting Enabled Systems and Applications Center (LESA), A National Science Foundation Engineering Research Center at Rensselaer Polytechnic Institute (RPI), are pleased to announce that Gyan Dutt, Technical Marketing Manager at Alpha and Dr. Robert Karlicek, Director of LESA at RPI, have co-chaired the 2017 iNEMI Solid State Illumination Industry Roadmap.

The iNEMI organization roadmaps the future technology requirements of the global electronics industry, identifies and prioritizes technology and infrastructure gaps, and helps eliminate those gaps through timely, high-impact deployment projects.

“The 2017 cycle Solid State Illumination road-mapping exercise was particularly challenging as well as rewarding due to rapidly growing LED lighting adoption, growth of new exciting applications and significant efforts on integration and cost reduction (both package and system level) over the last two years,” said Gyan Dutt of Alpha Assembly Solutions. “The chapter addresses the key trends in packaging technology like flip-chip/ CSP growth, chip-on-boad (COB) and new substrate approaches for thermal management and flexible form factors”.

In regards to emerging technologies, Dr. Robert Karlicek comments, , “Current technical and business issues involved with smart lighting, which refers to applications like human-centric lighting, visible light for wireless connectivity, or color tunability, were addressed for the first time during this exercise. The chapter provides a prioritized list of gaps and the technical approaches, both mainstream and early-stage, being pursued to overcome those challenges.”

Gyan Dutt is currently the Technical Marketing Manager for LED at Alpha Assembly Solutions. He is responsible for LED segment market development and product portfolio management. He has more than 15 years’ experience in technical marketing, applications engineering and product development in semiconductor packaging and electronics assembly in Americas and Asia Pacific region.

Dr. Robert F. Karlicek, Jr. is currently the Director of the LESA - Lighting Enabled Systems & Applications (formerly Smart Lighting Engineering Research Center) at Rensselaer Polytechnic Institute, an NSF and industry funded program exploring advanced applications for next generation lighting. Prior to joining RPI, he spent over 30 years in industrial research and R&D management positions with corporations including AT&T Bell Labs, EMCORE, General Electric, Gore Photonics, Microsemi, Luminus Devices and SolidUV. His technical experience includes epitaxial growth of high performance LEDs and lasers, advanced device fabrication and high power LED packaging, thermal management, control systems design and applications in solid state lighting as well as other novel LED uses such as IR and UV LED applications.

About iNEMI                                                                                                                                                                                  

The International Electronics Manufacturing Initiative (iNEMI) is a not-for-profit R&D consortium of approximately 100 leading electronics manufacturers and suppliers with cumulative member revenues exceeding $750 billion, associations, research institutes, government agencies and universities.  The iNEMI Mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future.  For more information, visit www.inemi.org.

About Alpha Assembly Solutions                                                                                                                                                                  

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. 

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands. 

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, visit www.AlphaAssembly.com

Share

Print


Suggested Items

3D Optical Inspection Provides ‘Eyes’ for Process Improvements in Industry 4.0

06/21/2019 | Jenny Yuh, Koh Young Technology, and Brent Fischthal, Koh Young America
Automated 3D solder paste inspection (SPI) and 3D automated optical inspection (AOI) systems have become an integral part of the printed circuit board assembly (PCBA) process because they help ensure high-quality production. As today’s board complexity is increasing, inspection technology has become even more critical.

Goepel electronic Solutions, Webinar Series, and Trends

06/19/2019 | Barry Matties, I-Connect007
Barry Matties catches up with Matthias Müller to chat about the wide range of test and inspection solutions currently being offered by Goepel electronic as well as the informative webinar series produced by the company to help further educate their customer base and promote technical discussion on a number of topics.

The Effectiveness of 75% IPA/25% DI Extraction Solution on No-clean Flux Residues

06/13/2019 | David Lober and Mike Bixenman, DBA, KYZEN; and Marietta Lemieux and Mark McMeen, STI
The continuous challenge in the electronics industry is to keep up with the demand for smaller, faster, and more reliable electronics. When it comes to cleaning, this rapid development of manufacturing and reliability challenges is juxtaposed with the slow pace of new test method development.



Copyright © 2019 I-Connect007. All rights reserved.