Indium to Feature Indium8.9HF Solder Paste at SMT Hybrid Packaging 2017


Reading time ( words)

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at SMT Hybrid Packaging, which will be held on May 16-18, 2017, in Nuremberg, Germany.

Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:

  • Demonstrates consistent printing performance for up to 12 months when refrigerated
  • Maintains excellent printing and reflow performance after remaining at room temperature for one month
  • Delivers excellent response-to-pause even after being left on the stencil for 60 hours

About Indium Corporation

Indium Corporation, the industry-leading source of void-reducing materials and performance, has specifically formulated Indium8.9HF solder paste to reduce voiding significantly below the industry average for improved finished goods reliability. Indium8.9HF delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.

Indium8.9HF has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly.

For more information about Indium Corporation’s low-voiding solder pastes, visit www.indium.com/avoidthevoid or see Indium Corporation at booth 4-321.

Share



Copyright © 2017 I-Connect007. All rights reserved.