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Mirtec President Brian D'Amico brings I-Connect Technical Editor Pete Starkey up to speed with the latest developments in 2D and 3D AOI and SPI inspection technologies. He also talks about the sales success of the MV-6 OMNI series in-line full-3D AOI machine, with advanced features such as 15-megapixel top-down camera and 3D digital multi-frequency Moire, but attractively priced to appeal to the small-to-medium scale user.
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Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
Philip Stoten, Scoop
The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.
Andy Shaughnessy, I-Connect007
You may have heard the name Martin Ziehbrunner before: he cofounded the equipment company Essemtec AG in 1992. He left the company in 2013, and soon he'd cofounded another SMT company, but with a twist. SMT Renting specializes in renting SMT equipment with an operational lease, primarily for the European market. In this interview, he explains how his latest company is challenging the normal way of acquiring SMT capital equipment.