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Mirtec President Brian D'Amico brings I-Connect Technical Editor Pete Starkey up to speed with the latest developments in 2D and 3D AOI and SPI inspection technologies. He also talks about the sales success of the MV-6 OMNI series in-line full-3D AOI machine, with advanced features such as 15-megapixel top-down camera and 3D digital multi-frequency Moire, but attractively priced to appeal to the small-to-medium scale user.
Watch The Interview Here
Pete Starkey, I-Connect007
David Bennett, president of Mirtec Europe, speaks with I-Connect007 Technical Editor Pete Starkey about the company's latest inspection technologies, the challenges that miniaturization can bring, and Mirtec's efforts to stay on the leading edge and never be a “me too” company.
Andy Shaughnessy, I-Connect007
Harald Eppinger, managing director of Koh Young Europe, speaks with I-Connect007 Managing Editor Andy Shaughnessy about the demands of the European market, the company's long-standing success with its solutions, and the future of Koh Young Europe.
Stephen Las Marias, I-Connect007
During the recent NEPCON South China exhibition in Shenzhen, Olivier Pirou, chief operating officer of Vi TECHNOLOGY, talks about achieving the perfect solder joint from the point of view of an inspection systems provider, and how manufacturers can strategize to achieve a zero-defect line.