IPC Hand Soldering Competition to Heat Up SMT Hybrid Packaging 2017


Reading time ( words)

IPC's Hand Soldering Competition at SMT Hybrid Packaging 2017 (May 16-18) will see skilled competitors go soldering iron to soldering iron, as they compete for cash prizes and a coveted spot at the IPC Hand Soldering World Championship located in Munich, Germany, this November.

Hand soldering of high density printed boards demands highly skilled operators to ensure a zero-defect soldering process, and this contest—IPC's annual competition at SMT Hybrid Packaging—will recognize the best skills in hand soldering complex printed board assemblies. Over three days, participants will compete against each other to build a functional electronics assembly within a 60-minute time limit. Assemblies will be judged on soldering in accordance with IPC-A-610F Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructors will serve as judges.

The IPC Hand Soldering Competition winner and two runners-up will each earn cash prizes: first place, €300; second place, €200; and third place, €100. In addition, the first-place winner will earn a chance to compete against the best hand soldering technicians from around the world at the IPC Hand Soldering World Championship, located in Munich, Germany, this November.

For more information, prospective competitors can contact Lars Wallin, IPC European Representative. On-site registration is possible if there is space available.

Share


Suggested Items

Start Your IPC APEX EXPO Show Experience Here

02/16/2018 | I-Connect007
As many prepare to travel to California from February 24 to March 1, IPC APEX EXPO 2018 will offer a collection of exciting events for both newcomers and industry veterans, including educational opportunities and showcase exhibitions. Want a sneak peek into the upcoming events at IPC APEX EXPO 2018? This exclusive pre-show coverage publication from I-Connect007 is all about San Diego or bust!

SuperDry’s Novel Approach to the Drying Process

02/07/2018 | Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.

PCB Pad Repair Techniques

01/08/2018 | Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.



Copyright © 2018 I-Connect007. All rights reserved.