Indium Features InFORMS Reinforced Solder Preforms at PCIM Europe 2017


Reading time ( words)

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, which will be held from May 16-18, 2017 in Nuremberg, Germany.

Indium is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder and a reinforcing matrix that, together, increase lateral strength and bondline co-planarity while improving thermal cycling reliability.

When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:

  • 4x improved thermal cycling reliability compared to a solder preform-only approach
  • 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
  • Reduced voiding (<1%)
  • Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment

For more information about InFORMS, visit www.indium.com/informs or see Indium Corporation at booth 7-315.

About Indium

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

Share


Suggested Items

Video from productronica 2017: Mycronic Discusses Precision Jetting Systems

11/17/2017 | I-Connect007
From the show floor during productronica 2017, Clemens Jargon, VP of Global Dispensing at Mycronic, discusses with I-Connect007 Technical Editor Pete Starkey the company’s portfolio of precision jetting equipment, with particular reference to the speed and versatility of the MYSmart series.

Solder Preforms 101: Ask the Expert

11/13/2017 | Patty Goldman, I-Connect007
At the recent SMTA International 2017 event, Jerry Sidone, product manager for the engineered materials at Alpha Assembly Solutions, speaks with I-Connect007 Managing Editor Patty Goldman about the voiding challenge, especially with bottom termination components, and how solder technologies from Alpha are helping PCB assemblers address this issue.

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.



Copyright © 2017 I-Connect007. All rights reserved.