Goepel Extends Support for Embedded JTAG Solutions Technology


Reading time ( words)

Goepel electronic is extending support for embedded JTAG solutions technology for the SPEA4060 flying probe testers. As a result, analogue pin cards from the flying probe test system (FPT) can now also be used in digital boundary scan tests--resulting in an even higher test coverage.

The flying probe test method can be used for flexible testing of discrete analogue components. Combining this with Goepel electronic embedded JTAG solutions opens up a vast range of possibilities for enhanced, interactive testing. Previously, only digital resources from the SPEA4060 could be used for this in JTAG/boundary scan testing. Users who exclusively used analogue pin cards in the FPT system were therefore unable to benefit from the advantages of the two combined test technologies.

On account of the long-standing and close cooperation between SPEA and Goepel electronic, customers have a sophisticated and well-established package of hardware and software available to them, which can be perfectly integrated in the SPEA4060 flying probe testers. The more cost-effective analogue pin cards also offer potential customers an enormous price advantage when making use of system integration with Goepel electronic.

Share

Print


Suggested Items

ICT or Flying Probe: Which Test Is Best for Your Assembly?

07/10/2019 | Russell Poppe, JJS Manufacturing
In-circuit test (ICT) and flying probe are two of the most popular types of automated test equipment (ATE) used in electronic printed circuit board assembly (PCBA).

Mentor and Seica Partner for Data Prep and Testing Big Boards

01/18/2019 | Pete Starkey, I-Connect007
Mark Laing, business development manager of the Valor division at Mentor, a Siemens company, and Luca Corli, director of sales at Seica, speaks with I-Connect007 Technical Editor Pete Starkey about the partnership between their two companies, which enables efficient data preparation for testing big boards, and accelerates new product introduction (NPI) cycles.

Design for Test in the U.S. Market

03/17/2016 | W. Scott Fillebrown, LIBRA INDUSTRIES INC.
With most high-volume printed circuit assembly being sent outside the United States, we have a unique challenge for testing the lower volume/high turnover assemblies domestically. However, with a little planning and the right contract manufacturer (CM), test does not need to be an issue.



Copyright © 2019 I-Connect007. All rights reserved.