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Lenthor Engineering recently installed a new CyberOptics SE500 solder paste inspection (SPI) system.
The SE500 will allow Lenthor to push inspection speeds to the highest level possible for even the most demanding assemblies without compromising on accuracy and dependability. The new system will help them to achieve high quality joints with accurate volume measurement every single time.
The SE500 provides 3-D height, volume and area measurements for boards with SCPs, micro-BGAs and other small pad sizes where volume is critical in joint reliability. The new system is also equipped with flexible circuit warp compensation algorithm to compensate for warp on complex shapes within a field of view.
David Moody, director of sales and marketing, said, "This machine is going to optimize our solder paste process, reduce rework and improve yield, allowing us to continue to enhance the service and support we provide to our customers."