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Lenthor Engineering recently installed a new CyberOptics SE500 solder paste inspection (SPI) system.
The SE500 will allow Lenthor to push inspection speeds to the highest level possible for even the most demanding assemblies without compromising on accuracy and dependability. The new system will help them to achieve high quality joints with accurate volume measurement every single time.
The SE500 provides 3-D height, volume and area measurements for boards with SCPs, micro-BGAs and other small pad sizes where volume is critical in joint reliability. The new system is also equipped with flexible circuit warp compensation algorithm to compensate for warp on complex shapes within a field of view.
David Moody, director of sales and marketing, said, "This machine is going to optimize our solder paste process, reduce rework and improve yield, allowing us to continue to enhance the service and support we provide to our customers."
Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.
Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.
Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.