IPC Seeks Papers for Wire Harness Manufacturing Conference


Reading time ( words)

IPC—Association Connecting Electronics Industries and the Wiring Harness Manufacturer's Association (WHMA) invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC/WHMA European Wire Harness Manufacturing Conference to be held October 3–4, 2017 at the Novotel Convention & Wellness Roissy CDG in Paris, France.  

Expert papers and presentations are being sought in the following areas:

  • IPC/WHMA-A-620 implementation
  • Quality requirements
  • Overview on the cabling and interconnection industry and contractors
  • Reliability issues and failure analysis
  • Overview on standards for no solder interconnection cables and counterfeiting
  • Standards and training
  • Connectors
  • Electrical testing
  • Tooling
  • Process equipment
  • Calibration
  • Wire harness troubleshooting
  • Connector interconnection environmental testing
  • Case studies on A-620 success

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results. Final selected presentations will be limited to 30 minutes.

"Wire harness manufacturers are on the front line of technical challenges. IPC and WHMA are organizing our first European wire harness conference to identify some of these challenges, explain IPC/WHMA-A-620 in depth and how the standard can help manufacturers with their business," said David Bergman, IPC vice president of standards and technology.

Technical conference paper abstracts are due April 21, 2017. To submit an abstract or course proposal, contact David Bergman at DavidBergman@ipc.org.

Share


Suggested Items

Strategies for Choosing Solder Paste for Successful Electronics Assembly

08/10/2018 | Jason Fullerton, Alpha Assembly Solutions
One common question from solder customers is, "How do I test and evaluate new solder pastes?" Although that seems like it should be a straightforward question with an easy answer, this could not be further from the truth. This article tells more about this, and how to best select solder pastes for your product.

Evaluating the Impact of Powder Size and Stencils on Solder Paste Transfer Efficiency

07/31/2018 | T. O’Neill, C. Tafoya, and G. Ramirez, AIM Metals and Alloys
Building upon an earlier study that focused on solder paste powder size, room-temperature aging and PCB pad and aperture designs, this study continues to investigate powder mesh size, but also examines stencil surface treatments and stencil foil tension.

Flex Circuit Assembly: Challenges and Strategies for Success

07/27/2018 | Stephen Las Marias, I-Connect007
The flexible printed circuit market is on track for growth. But dealing with flex circuits during assembly is very different from rigid PCBs. This article highlights some of the assembly challenges when working with flex circuits, and strategies to address them.



Copyright © 2018 I-Connect007. All rights reserved.