Indium Senior Product Manager to Present at AEC Reliability Workshop


Reading time ( words)

Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the 2017 Automotive Electronics Council (AEC) Annual Reliability Workshop April 18-20 in Novi, Mich. 

Dr. Mackie will present Semiconductor Assembly: Modular and SMT Materials Reliability for Evolving Automotive Electronics Applications. This paper includes technical discussions on the reliability of SMT materials in automotive assembly. 

Dr. Mackie is an electronics industry expert in physical chemistry, surface chemistry, rheology, and semiconductor assembly materials and processes. He has more than 20 years of experience in new product and process development, and materials marketing in all areas of electronics manufacturing, from wafer fabrication to semiconductor packaging and electronics assembly. Dr. Mackie has a doctorate in physical chemistry from the University of Nottingham, U.K., and a Master of Science in Colloid and Interface Science from the University of Bristol, U.K. He is also formally trained in Six Sigma – Design of Experiments. 

The Automotive Electronics Council (AEC) was created for the purpose of establishing common part-qualification and quality-system standards. A subset of the organization, the AEC Component Technical Committee is the standardization body for establishing the benchmarks for reliable, high-quality electronic components.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA. 

For more information about Indium Corporation, visit www.indium.com

Share


Suggested Items

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.

Optimal Electronics Sets Sight on Growth

11/14/2017 | Stephen Las Marias, I-Connect007
In an interview with SMT Magazine, Dr. Ranko Vujosevic, CEO and CTO of Optimal Electronics, speaks about the latest technology developments at his company, and his plans to sustain growth. He also talks about his paper on lights-out electronics assembly, the technologies that would support this vision, and the ultimate goal of Industry 4.0.



Copyright © 2017 I-Connect007. All rights reserved.