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It is of the utmost importance that the soldering process should be perfect. But soldering is just too complex a process, and further complicating the situation, the requirements and technologies vary between our industry’s market segments.
The April 2017 issue of SMT Magazine looks into some of the different factors and challenges impacting yield when it comes to soldering, and provides strategies on addressing them.
Read the March issue of SMT Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.
Save the PDF version to your devices for future reference.
Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.
Barry Matties, I-Connect007
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.
Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.