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It is of the utmost importance that the soldering process should be perfect. But soldering is just too complex a process, and further complicating the situation, the requirements and technologies vary between our industry’s market segments.
The April 2017 issue of SMT Magazine looks into some of the different factors and challenges impacting yield when it comes to soldering, and provides strategies on addressing them.
Read the March issue of SMT Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.
Save the PDF version to your devices for future reference.
Jonas Sjoberg, Chris Nash, David Sbiroli, and Wisdom Qu, Indium Corporation
Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.
Stephen Las Marias, I-Connect007
From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.
Patty Goldman, I-Connect007
At the recent SMTA International conference, I-Connect007 Managing Editor Patty Goldman caught up with Ram Wissel, VP of Global Technology at KYZEN, to talk about the latest cleaning challenges, and bringing Industry 4.0 into the world of cleaning in PCB assembly.