Indium Features Reclaim and Recycle Program at SVC TechCon 2017


Reading time ( words)

Indium Corporation will feature its reclaim and recycle program at the Society of Vacuum Coaters 2017 Technical Conference (SVC TechCon), which will be held from April 29–May 4 in Providence, Rhode Island. 

SVC TechCon, now holding its 60th annual technical conference, is the trade event dedicated to vacuum coating technologies. The TechCon presents stimulating content across all nine of its coating technology categories, plus an in-depth exploration of this year’s Symposium Topic, Coatings for Healthcare, Biometric Monitoring, and Bio-Interfaces. Each technical session will mix basic and applied research with innovations and tools to transition R&D results into production. 

At the event, Indium will showcase its reclaim services for most indium-containing materials, including: ITO, IZO, IGZO; spent targets; used bonding materials; other unneeded or excess materials; and worn out/replaced cryogenic seals. 

For information about Indium Corporation’s reclaim and recycling programs, visit Booth #713. 

About Indium

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com

Share

Print


Suggested Items

Top 10 Most-Read SMT007 Articles for March

04/01/2019 | I-Connect007
Starting this month, we will take a look back at the most popular SMT007 news, articles, interviews, and columns over the past 30 days. For the month of March, these are the top 10 most-read SMT007 articles. Check them out.

RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

03/06/2019 | Real Time with...IPC
Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.

Top 10 Most-Read SMT Interviews of 2018

01/04/2019 | Stephen Las Marias, I-Connect007
We continue our top 10 lists, this time with the most-read SMT interviews in 2018. Topping the list is an interview with Joe O’Neil and Matthew Becker of Power Design Services (PDS), along with Ted Park of Green Circuits, who announced their merger last year.



Copyright © 2019 I-Connect007. All rights reserved.