Indium Features Reclaim and Recycle Program at SVC TechCon 2017


Reading time ( words)

Indium Corporation will feature its reclaim and recycle program at the Society of Vacuum Coaters 2017 Technical Conference (SVC TechCon), which will be held from April 29–May 4 in Providence, Rhode Island. 

SVC TechCon, now holding its 60th annual technical conference, is the trade event dedicated to vacuum coating technologies. The TechCon presents stimulating content across all nine of its coating technology categories, plus an in-depth exploration of this year’s Symposium Topic, Coatings for Healthcare, Biometric Monitoring, and Bio-Interfaces. Each technical session will mix basic and applied research with innovations and tools to transition R&D results into production. 

At the event, Indium will showcase its reclaim services for most indium-containing materials, including: ITO, IZO, IGZO; spent targets; used bonding materials; other unneeded or excess materials; and worn out/replaced cryogenic seals. 

For information about Indium Corporation’s reclaim and recycling programs, visit Booth #713. 

About Indium

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com

Share


Suggested Items

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.

DFx on High-Density Assemblies

12/01/2017 | Jonas Sjoberg, Chris Nash, David Sbiroli, and Wisdom Qu, Indium Corporation
Use of new technologies poses a number of challenges for solder paste selection, PCB design, assembly process, and reliability. The type of end product will have different challenges, concerns, and requirements in all aspects. The assembly line for many of these end products will look very similar, but specification limits would be different.

Creating the Perfect Solder Joint

11/03/2017 | Stephen Las Marias, I-Connect007
From a visual standpoint, a good solder joint should be smooth, bright, shiny, clean, and have a nice concave solder fillet. But how do you ensure that inside those joints, good intermetallic bonds are formed? Solder joints play several different roles, and they represent several different opportunities to be a problem, a partial improvement, or a complete improvement. Since all solder joints aren’t created equal, the first step is to understand what is expected or required of that joint.



Copyright © 2017 I-Connect007. All rights reserved.